Electrical Failure Analysis Engineer

Responsibilities and Tasks 

• Identify and communicate yield issues on production and test wafers 

• Analyze probe, parametric and fab data to identify yield issues 

• Perform electrical and visual characterization of failing die to establish fail mechanism. 

• Deprocessing of failing die to identify defects 

• Publish and present reports on analysis of process experiments detailing yield impact. 

• Apply knowledge of Si fabrication steps to identify and trouble shoot yield issues. 

• Identification of yield excursions and correlation back to root cause. 

• Detects complicated process interactions and relates it to failures. Provides, feedback to increase yield goals 

• Identifies unexpected fail mechanisms and helps resolve underlying issues. 

• Identify interactions between process modules and/or equipment to detect fail mechanisms. 

• Using Device Physics knowledge relate parametric shifts to yield issues 

• Demonstrate expertise in product architecture, cell operation, probe flows, and related topics to increase yield. 

• Propose methods to determine solutions for new fail mechanism 

• Recognize opportunities for yield improvements and provide feedback to R&D management. 

• Standardize methods and procedures to promote consistent, comparable, and repeatable processes to improve yield. 

• Use innovative methods to tackle highly complex problems 

• Define and implement plans to solve outstanding yield issues that will drive quality and optimize yield. 

Safety Related 

• Identify and promptly report hazards 

• Follow safety procedures and area work rules including proper PPE, lockout and chemical safety. 

• Operate and maintain equipment and tools within manufacturer’s and company guidelines 

• Use proper lifting techniques and work in an ergonomically correct manner 

Requirements. 

• Bachelors degree in electrical / electronic engineering or a related field 

• Experience working with tools such as bench testers, Oscilloscopes, Curve Tracer etc 

• 2+ Year of industry experience or demonstrable experience in debugging electrical failures of semiconductor memory  

• Knowledge of assembly process like wire bond, die attach, DBG, Molding, Saw singulation, laser mark, laser cut, etc. is a plus